Gold embrittlement mitigation
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. Voiding in SMT solder joints & Gold plated components dislodging from the PCB are two well-known failure modes of Gold Embrittlement.
BGA Test and Technology has developed a Robotic Process which uses SnPb alloy dynamic solder wave for gold removal.
IPC –J-STD-001 criterion. 4.5.1 Gold Removal
Gold Shall Be Removed: N1P2D3
- From at least 95% of the surfaces to be soldered of the Through-hole component leads with 2.54 μm or more of gold thickness.
- From 95% of all surfaces to be soldered of Surface mount components regardless of gold thickness.
- From the surfaces to be soldered of Solder terminals plated with 2.54 μm or more of gold thickness.
- Scanning Electron Microscope (SEM) – Post-Ball Shear Analysis
- Cleanliness – Ionic Contamination Analysis
- Electrical Testing (Pre & Post Re-balling)
A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component in the
assembly.
Please contact us for more information or quote.
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High Quality Technology
BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers.
