AS9100D & ISO9001:2015 Certified; ANSI/ESD-S20.20-2014 Certified;  ITAR Registered
Cage Code: 6EMC9

Gold embrittlement mitigation

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. Voiding in SMT solder joints & Gold plated components dislodging from the PCB are two well-known failure modes of Gold Embrittlement.
BGA Test and Technology has developed a Robotic Process which uses SnPb alloy dynamic solder wave for gold removal.

IPC –J-STD-001 criterion. 4.5.1 Gold Removal

Gold Shall Be Removed: N1P2D3

A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component in the

Please contact us for more information or quote.
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High Quality Technology

BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers.

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