AS9100D & ISO9001:2015 Certified; ANSI/ESD-S20.20-2014 Certified;  ITAR Registered
Cage Code: 6EMC9

RHSD Robotic Hot Solder Dip


BGA Test & Technology utilizes state of the art, 6-axis Robotic Hot Solder Dip (RHSD) machines for processing components. Operators can control all process parameters including:

Our high volume, high mix Robotic system is designed to flux, Pre-heat, Solder Dip, and clean virtually any style package of electronic component with a Precise Repeatable Process.
Our RHSD system allows us to comply with (meet any of) the following industry standards for solder dipping/solderability.
Please contact us for more information or quote.
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High Quality Technology

BGA Test & Technology is at the forefront of retinning and reballing technologies. Our processes meet all the quality criteria per GEIA-STD-0006 and the bga reballing standards required by both Military & Aerospace customers.

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